Ultra-fast fabrication of phosphor in glass via laser sintering using silicon wafers

Abstract

One of the essential components for fabricating high-power-driven light-emitting diodes (LEDs) is phosphor in glass (PiG). Mixing, sintering, and polishing are necessary for this PiG fabricating technique for the blue LED to function as a light converter. However, oxidation of the phosphor during the sintering process result in degradation, and the yield lowers during the polishing stage. Here we suggest a laser sintering method to fabricate the PiG that has the advantages of a shorter process time and an increased yield. The quick processing time may inhibit the phosphor oxidations, and the Si wafer effectively inhibits bending during the laser sintering. Utilizing silicon wafers is the key to making the process practically usable. Testing on blue LED chips with 250 mA operating currents demonstrates sufficient performance for a PiG photoconverter fabricated using this laser sintering approach. The suggested technique can contribute to the development of the PiG industry due to its high efficiency.