Abstract
A novel idea for ultimate noise isolation in high-speed digital systems on packages and printed circuit boards (PCBs) is presented. Ultimate noise isolation in high-speed digital systems on packages and PCBs can be achieved using the following concept: ‘a power island surrounded by a plurality of mixed alternating impedance electromagnetic bandgap (AI-EBG) structures-based power distribution network’. In this idea, the gap around the power island provides excellent isolation from DC to the first resonant frequency of the parallel plates in packages or in PCBs and mixed AI-EBG structures provide excellent isolation from around the first resonant frequency to a substantially infinite frequency. This novel structure is designed, fabricated, and measured, which demonstrates ultimate noise isolation capability in high-speed digital systems on packages and PCBs.
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