Abstract

Conventional field-effect transistors (FETs) are not expected to satisfy the requirements of future large integrated nanoelectronic circuits because of these circuits’ ultra-high power dissipation and because the conventional FETs cannot overcome the subthreshold swing (SS) limit of 60 mV/decade. In this work, the ordinary oxide of the FET is replaced only by a ferroelectric (Fe) polymer, poly(vinylidene difluoride-trifluoroethylene) (P(VDF-TrFE)). Additionally, we employ a two-dimensional (2D) semiconductor, such as MoS2 and MoSe2, as the channel. This 2D Fe-FET achieves an ultralow SS of 24.2 mV/dec over four orders of magnitude in drain current at room temperature; this sub-60 mV/dec switching is derived from the Fe negative capacitance (NC) effect during the polarization of ferroelectric domain switching. Such 2D NC-FETs, realized by integrating of 2D semiconductors and organic ferroelectrics, provide a new approach to satisfy the requirements of next-generation low-energy-consumption integrated nanoelectronic circuits as well as the requirements of future flexible electronics.

Highlights

  • The development of integrated nanoelectronic devices together with the scaling down of field-effect transistors (FETs), has rendered energy consumption a nonnegligible factor for future electronics applications

  • We realize a 2D negative capacitance (NC)-FET based on the metal–ferroelectric–semiconductor (MFS) structure, in which the underlying Metal–oxide–semiconductor FETs (MOSFETs) as two separate circuit entities connected by a wire.[36]

  • We comprehensively investigated does the metal–ferroelectric– metal–insulator–semiconductor (MFMIS) device.[36] the thickness of ferroelectrics in these 2D negative capacitance FET (NC-FET), and an subthreshold swing (SS) of

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Summary

Introduction

The development of integrated nanoelectronic devices together with the scaling down of field-effect transistors (FETs), has rendered energy consumption a nonnegligible factor for future electronics applications. We realize a 2D NC-FET based on the metal–ferroelectric–semiconductor (MFS) structure, in which the underlying MOSFET as two separate circuit entities connected by a wire.[36] Without this interlayer metal, an MFIS device can be achieved only if a ferroelectric and an insulation composite film are used as the gate dielectric.

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