Abstract
Summary With the advances of the electronics industry, the continuing trend of miniaturization and integration imposes challenges of efficient heat removal in nanoelectronic devices. Two-dimensional (2D) materials, especially graphene and hexagonal boron nitride (h-BN), are widely accepted as ideal candidates for thermal management materials due to their high intrinsic thermal conductivity and good mechanical flexibility. In this review, we introduce phonon dynamics of solid materials and thermal measurement methods at nanoscale, and highlight the unique thermal properties of 2D materials in relation to sample thickness, domain size, and interfaces. In addition, we discuss recent achievements of thermal management applications in which 2D materials act as heat spreader and thermal interface materials based on their controlled growth and self-assembly. Finally, critical consideration on the challenges and opportunities in thermal management applications of 2D materials is presented.
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