Abstract
We propose a model of random deposition and erosion for carbon–nitrogen film growth. Particles C and N represent carbon and nitrogen atoms and are released with probabilities p and 1−p, respectively. Particle C aggregates upon contact with the surface. Particle N annihilates with a top C (N) with a probability of q (1). The line p=q/2 separates the regimes of growth and erosion. As p decreases for fixed q the deposition rate decreases, while the bulk concentration of N and the surface roughness increase. It describes qualitatively the growth of plasma deposited carbon–nitrogen films, and is in good quantitative agreement with results in acetylene–nitrogen atmospheres.
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