Two-level Metallization and Module Integration of Point-contacted Solar Cells

Abstract

We present a module integration process for back junction back contact (BJBC) solar cells featuring point contacts to the back surface field (BSF). We apply two metallization layers. A first metal layer of aluminum is deposited onto the rear side of the cell and carries the current extracted from the polarity with the larger surface area fraction, e.g. from the emitter. The second metallization layer is an Al layer on a transparent substrate that we laser-weld to the small and point-shaped regions of the other polarity, e.g. the BSF region. We use a polymer for insulation between the two metal layers. The Al layer on the substrate also serves for cell interconnection, i.e., it enables module integration. Such an interconnection structure halves the fill factor losses due to the metallization. First proof-of-principle modules show a shunt free interconnection, no laser-induced damage, and an energy conversion efficiency of up to 20.7%.