Abstract
A two layer planarization (TLP) process has been developed to solve the profile variation problems encountered in conventional planarization. All the topographic features are smoothed down regardless of their size and spacing. The TPL process involves a first positive photoresist layer spun onto the substrate and exposed through a negative of the mask of the pattern. After development and cure, a second layer is spun on to flatten the residual undulations. The final result is a completely flat surface.
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