Abstract
This study is concerned with the thermal stress analysis of a butt adhesive joint which contains circular holes and fillers in the adhesive and is under non uniform temperature held. In the analysis, the adherends and fillers are assumed to be rigid and the adhesive is replaced with a finite strip containing holes and rigid fillers and the thermal stress distribution in the adhesive is analyzed using a two-dimensional theory of elasticity. The effects of size and location of circular holes and rigid fillers on the stress distributions at the interface and at the filler and hole peripheries are clarified by numerical calculations. For verification, photoelastic experiments were performed using an epoxide resin plate containing small holes and fillers, to model an adhesive in the joint. The analytical results were fairly consistent with the experimental ones.
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