Abstract
This study focuses on an innovative method for spin coating called the two-dimensional (2D) spin coating method. Using a centrifugal force applied by a rotary machine perpendicular to the wafer surface body, a vertical centrifuge force (VCF) was generated. The VCF allowed controllable artificial gravity acceleration to be generated and caused the coating to face this elevated gravity acceleration to adjust and normalize the high and low surface tension stresses. Previous surface leveling mathematics were analyzed and modified. The modified calculations indicate that the effect of additional gravity exerted on the liquid’s surface can reduce the amplitude of surface leveling. To experimentally investigate this phenomenon, a 2D spin coater was designed and manufactured. Higher artificial gravity overcame some common coating defects, such as cloudiness, edge beading, inner layer bubbling, and unsmooth surface leveling. Photoresist (AZP4620) was used as the coating material. The surface roughness was analyzed by atomic force microscopy (AFM) and the layer properties were also imaged by scanning electron microscopy (SEM). The AFM results (average and root-mean-square roughness) indicated a decrease in surface leveling amplitude by increasing the VCF. SEM images showed condensed layers without any porosity or rupture. The experimental results agreed with the simulations and calculated values.
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