Two dimensional shear lag solution for stress transfer between rectangular piezoelectric wafer transducer and orthotropic host plate

Abstract

Abstract An accurate assessment of the local interfacial stress distribution between piezoelectric transducers and the host plate is fundamental to their effective use for actuation and sensing applications. In this paper, a two dimensional shear lag model for the stress transfer between rectangular piezoelectric wafer transducer and orthotropic host plate bonded through an adhesive layer is developed. An accurate iterative analytical solution of the governing equations is presented using the recently developed mixed-field multiterm extended Kantorovich method (MMEKM). Both actuation and sensor modes are accounted for through the appropriate boundary conditions. A convergence study reveals that the MMEKM gives very accurate results even with a single-term solution and the results converge within three iterations. Parametric studies are conducted to illustrate the effects of thicknesses of the adhesive layer, the host plate and the transducer, aspect ratio of transducer, and longitudinal to transverse modulus ratio of host plate on the actuator stresses and interfacial shear stresses induced by actuation potential. The effect of transverse piezoelectric constant d 32 on the interfacial shear stress is also shown.