Abstract
Efficient and highly functional three-dimensional systems that are ubiquitous in biology suggest that similar design architectures could be useful in electronic and optoelectronic technologies, extending their levels of functionality beyond those achievable with traditional, planar two-dimensional platforms. Complex three-dimensional structures inspired by origami, kirigami have promise as routes for two-dimensional to three-dimensional transformation, but current examples lack the necessary combination of functional materials, mechanics designs, system-level architectures, and integration capabilities for practical devices with unique operational features. Here, we show that two-dimensional semiconductor/semi-metal materials can play critical roles in this context, through demonstrations of complex, mechanically assembled three-dimensional systems for light-imaging capabilities that can encompass measurements of the direction, intensity and angular divergence properties of incident light. Specifically, the mechanics of graphene and MoS2, together with strategically configured supporting polymer films, can yield arrays of photodetectors in distinct, engineered three-dimensional geometries, including octagonal prisms, octagonal prismoids, and hemispherical domes.
Highlights
Efficient and highly functional three-dimensional systems that are ubiquitous in biology suggest that similar design architectures could be useful in electronic and optoelectronic technologies, extending their levels of functionality beyond those achievable with traditional, planar two-dimensional platforms
Among the most recently introduced methods is a scheme in which compressive buckling associated with a stretched elastomeric substrate guides the mechanical assembly of elaborate 3D mesostructures, some with designs reminiscent of those achieved in macroscale structures by origami/kirigami, with specified shapes and with sizes that can span several orders of magnitude in characteristic dimensions, down to the submicron regime in lateral features and to a few tens of nanometers in thickness[12,13,14,15]
Patterned encapsulation using SU-8 yields thick and thin regions designed to aid in guiding the assembly process
Summary
Efficient and highly functional three-dimensional systems that are ubiquitous in biology suggest that similar design architectures could be useful in electronic and optoelectronic technologies, extending their levels of functionality beyond those achievable with traditional, planar two-dimensional platforms. Among the most recently introduced methods is a scheme in which compressive buckling associated with a stretched elastomeric substrate guides the mechanical assembly of elaborate 3D mesostructures, some with designs reminiscent of those achieved in macroscale structures by origami/kirigami, with specified shapes and with sizes that can span several orders of magnitude in characteristic dimensions, down to the submicron regime in lateral features and to a few tens of nanometers in thickness[12,13,14,15] These ideas leverage an intimate interplay between materials and microstructural mechanics, with diverse examples of use with silicon membranes, metallic electrodes, and polymer films in hundreds of different 3D geometries[13,14,15,16].
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