Two-dimensional device modeling and analysis of GaInAs metal–semiconductor–metal photodiode structures

Abstract

A two-dimensional self-consistent time-dependent simulation technique has been developed to investigate electron-hole transport processes in the active region of metal–semiconductor–metal (MSM) interdigitated photodiode structures and to analyze their high-speed response. The distribution of the electric field inside the MSM device is determined by numerically solving the two-dimensional Poisson’s equation by the modified fast elliptic solver method. A set of superparticles photogenerated at a particular wavelength is analyzed with a given initial distribution of the potential and given boundary conditions, and the evolution of the particles is traced in time through the active region of the MSM device. Circuit loading, electric field effects in the MSM structure with various finger separations, background doping, carrier trapping, and recombination are included in the simulation program. Owing to miniaturization of devices, the classical scaling laws lose their validity while various performance degrading effects appear. The simulations show that the main problem in MSM devices with a small contact separation is the low electric field penetration depth. This results in different electron and hole collection rates and in a poor response time. The trade-off between the high-speed response and the internal quantum efficiency is examined and ways to improve the high-speed response are indicated. Modeling results are compared with experimental data on Ga0.47In0.53As based MSM photodiodes.