Abstract

A surface potential-based low-field drain current compact model is presented for two-dimensional (2D) transition metal dichalcogenide (TMD) semiconductor field-effect transistors that takes into account the effect of interface trap states on device current–voltage (Ids–Vgs) characteristics and transconductance gm. The presence of interface trap states detrimentally affects device Ids–Vgs performance. Minimal work exists on the extraction of trap states (cm−2 eV−1) of MoS2/high-K dielectric/metal-gate stacks. Additionally, there is a lack of compact models for 2D TMD MOSFETs that can take into account the effect of trap states on device Ids–Vgs performance. This study presents a method to extract the interface trap distribution of MoS2 MOSFETs using a compact model. Presented as part of the model is a surface potential/interface trap charge self-consistent calculation procedure and a drain current expression that does not need numerical integration. The model is tested against reported experimental Ids–Vgs data, and excellent agreement is found between the experiment and the model.

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