Turtle base with fin perforated heat exchangers for the 2.5D and 3D IC structures

Abstract

Heat generation is unavoidable in electronic devices and multicore processors, because of the voltage drops or heavy power consumption of the devices. Heat is getting generated in the complex circuits or in the Through Silicon Via of a 2.5 and 3Dimensional Integrated Circuits structures. The challenge is to design a most optimized and efficient heat exchanger, by keeping reduced mass and dimensions of the existing heat exchangers and also keep same cooling fans, instead of re-inventing the cooling devices. This paper proposes a new design of a heatsink to address such thermal challenges with the laminar forced convective heat transfer on a turtle base with fins perforated in different shapes. An analysis of proposed turtle base geometry with respect to the thermal gradient of the chips, would be beneficial for realistic applications. This kind of concept has not been observed till now. Because of this reason, obtained results are compared and adhered to same methodologies of testing with the previously published data and results. The Computational Fluid Dynamics study determines the effects of various types of perforations along with solid fin, with various design parameters of heat exchangers. The results conclude that the turtle base has better thermal transfers to the various perforated fins than solid rectangular bases. Club-shaped perforated fins showed better heat transfer performance, followed by hexagonal shaped perforated fins, among other perforated fins. Effect of friction drop is studied, showing a sharp fall in friction drop were due to wide perforations, and hence the varied performance observed.