Turbulent fluid flow and heat transfer analysis of heated rectangular blocks encountered in electronics enclosures

B Ch Nookaraju,S Tummala,S Singh,S Kosaraju,P Bobba

doi:10.1051/e3sconf/202018401027

Abstract

Computational investigation of steady, two-dimensional heat transfer attributes for forced convective chaotic discharge in a vertical channel of cluster of heated rectangular sections is performed. The discharge is deemed to be periodic fully developed so that the issue is determined for two extending zone and explanation is developed to more number of sections. This structure reproduces the driven convective cooling of a cluster of engraved circuit panels confronted in computerize belongings. Two mathematical statements for k- ℇ model is used for modeling for the turbulence and the finite volume methodology is used. Computations are performed for Reynolds numbers ranging from 6000-12000, Prandtl number of 0.7 and various geometric parameters characterizing the problem. As Reynolds number steps up the Nusselt Number increases. Re-circulations undermine the local Nusselt number when matched with comparing variation from a identical plate. The velocity contours, temperature distributions, variation of turbulent kinetic energy and kinetic energy dissipation rates in a vertical channel is found. With the blocks in the cluster, pressure fall is higher in resemblance to plane duct.

Highlights

There are several electronic equipment in practice, which contain many printed circuit boards stacked in shelves
The cooling of such printed circuit boards is done by blowing air through the stacks
Forced convective cooling of digital belongings proceeds to be an necessary thermal control process in operations, which consist of chip arrangement for exclusive personal computers, laptops, signal processors and workstations

Summary

Introduction

There are several electronic equipment in practice, which contain many printed circuit boards stacked in shelves. The cooling of such printed circuit boards is done by blowing air through the stacks. The airflow rate must be such that the surface temperature of the electronic chips is a minimum. Forced convective cooling of digital belongings proceeds to be an necessary thermal control process in operations, which consist of chip arrangement for exclusive personal computers, laptops, signal processors and workstations. Further leady application may consist of mixed circuit arrangement in marvelous data processors, housewares, projectile advancement, and rocket and arena conversation gadgets. The current issue involves the improvement of the numerical design for the chilling technique of Integrated Chips placed on a vertical circuit printed circuit boards. Kim and Anand [4] study revealed that substrate conduction could be an influential criterion in the arrangement and interpretation of chilling carriers of computerized belongings

Methods

Results

Conclusion