Abstract

There has been a growing demand for materials with superior absorption capabilities, such as strong absorbing capacity, thin thickness, and light weight, to solve challenges related to EM radiation pollution. While the majority of the research is focused on optimizing material compositions, component microstructure and absorber structure are also critical factors for improving microwave absorption performance. In this research, we show how the microstructure of components and absorber design may increase dissipation features. Solvothermal and hydrothermal methods were utilized for synthesizing mesoporous CuS micro-particles with a 3D hierarchical structure as a dielectric component and nanospheres like NiCo2O4 as magnetic components respectively. The formation of pure phases with the mentioned microstructures was confirmed via XRD, FTIR, UV–Vis, XPS, VSM, FESEM and BET analysis. According to VNA results, the minimum reflection loss can be achieved to −33 dB at 11 GHz with a total thickness of 2 mm in which each layer thickness was considered 1 mm (CuS placed at top layer and NiCo2O4 placed at bottom layer). The RL values of bilayer absorber were strongly affected by both the microstructure of the components and tuning the thickness and arrangement of each layer. We offer a potential technique for enhancing microwave dissipation performance by combining the synergistic effects between the microstructure, thickness and arrangement of layers in a bilayer absorber.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.