Abstract

In this paper, we propose TRouter, a thermal-driven PCB routing framework via a machine learning model. The model is designed to capture the long-range spatial information from the PCB layout and predict thermal distribution. The information contains pads, vias, components and wire segments. A gradient in each grid cell obtained from the backpropagation is integrated into a full-board routing algorithm to guide thermal-aware wire detour and via punching. To achieve a significant speedup, we construct a conflict graph according to whether overlapping among convex hulls of nets. A greedy-based method is adopted to remove non-root nodes from all nodes. Then a task graph is constructed to improve the parallelism. We conduct experiments on open-source benchmarks to illustrate our TRouter can achieve significant speedup and lower-temperature designs, compared with a state-of-the-art PCB routing algorithm.

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