Abstract
A facial one-pot method for the preparation of phenyl silicone resins is introduced. Vinyl end-capped phenyl silicone resin (i) and phenyl hydrosilicone resin (ii) were successfully prepared by selecting trifluoromethanesulfonic acid (TfOH) as the catalyst. The structures and the thermo-optical performances of the resulting resins were investigated by IR, NMR, GPC, TGA and UV–Vis, respectively. The results show that the yield, the transparency and the refractive index for resin (i) are 95%, 90.4% and 1.5253, respectively, and for resin (ii) are 94%, 92.8% and 1.5201, respectively. The properties of the cake obtained by hydrosilylation of resin (i) and (ii) in the ratio of 1:1 for LED chip encapsulation were studied, and the packaging effect was examined preliminarily.
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