Abstract
The grain flow lubrication, based on Haff's grain flow theory and the Patir/Cheng flow factors method, is applied in the simulations of rough slider bearings and chemical mechanical polishing. In this paper, the results of flow factor, the performance of rough slider bearings and the mechanism of the CMP process for grain flow are briefly demonstrated. An improved CMP model, considering the partial hydrodynamic grain flow lubrication and elastic-plastic microcontact theory, is also proposed. The contact area ratio and the elastoplastic contact area ratio are presented to improve the understanding of CMP mechanisms.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
