Abstract
This paper presents the computer-aided design of three new distributed-resistance thin-film networks of various triangular, rhomboid, and V geometries. The triangular network may avoid two shortcomings of earlier rectangular networks: nonuniform current density and power dissipation in the resistance film and computational difficulty involved in elliptic function transformation. In distributed-resistance network design, uniform power dissipation is desirable for higher operational reliability and stability, and more efficient use of substrate area. Rhomboid and V networks appear attractive for applications requiring low and high insertion loss, respectively. A PCM decoder design using triangular networks is presented as an example to demonstrate the merits of the new geometry.
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