Abstract
Manufacturing of semiconductor devices continues to follow Moore{section sign}s Law. Key challenge of future manufacturing of microand nanotechnologies will be a much tighter process control. This paper will describe some trends in advanced process control (APC). Definitions of APC, current status of basic principles, elements and future requirements will be given. Three methods of advanced process control are presented, which have to be adapted to further challenges in micro- and nanotechnologies: integrated metrology, run-to-run control (feed-forward / feedback control) and fault detection and classification (FDC). Integrated process and metrology tools have to provide relevant data. The data may be tool data, process data and/or wafer data. An engine analyzes the data for SPC, application of run-to-run control loops and fault detection in order to initiate necessary control actions. Examples from 20 years of own R&D embedded in European activities related to these focal fields will be given.
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