Abstract
A new trench IGBT with carrier bypass region is proposed in paper. In this new structure, P+ bypass regions are introduced, which provided hole carrier bypass, reduced the parasitic thyristor effect in the trench IGBT, allowed higher safe operating area. The results are shown that the temperature characteristic of the new trench IGBT is better than that of the conventional trench IGBT. The metal which contacts the bypass regions and the emitters helps the thermal dissipation at high temperature and reduces the emitter contact resistance.
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