Abstract
Controlling trapped charges at the interface between a two-dimensional (2D) material and SiO2 is crucial for the stable electrical characteristics in field-effect transistors (FETs). Typically, gate-source bias has been used to modulate the charge trapping process with a narrow dielectric layer with a high gate electric field. Here, we observed that charge trapping can also be affected by the lateral drain-source voltage (VDS) in the FET structure, as well as by the gate-source bias. Through multiple VDS sweeps with increasing measurement ranges of the VDS, we demonstrated that the charge trapping process could be modulated by the range of the applied lateral electric field. Moreover, we inserted a hexagonal boron nitride (h-BN) layer between the MoS2 and SiO2 layer to explore the charge trapping behavior when a better interface is formed. This study provides a deeper understanding of controlling the electrical characteristics with interface-trapped carriers and lateral electrical fields in 2D material-based transistors.
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