Abstract
We present a detailed analysis of the trap states in atomic layer deposition Al2O3/InAlN/GaN high electron mobility transistors grown by pulsed metal organic chemical vapor deposition. Trap densities, trap energies and time constants are determined by frequency-dependent conductance measurements. A high trap density of up to 1.6 × 1014 cm−2eV−1 is observed, which may be due to the lack of the cap layer causing the vulnerability to the subsequent high temperature annealing process.
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