Abstract
Thin gold films were deposited by “sputtering” onto thick copper substrate. The crystalline structure and topography of the deposits were investigated by scanning and transmission electron microscopy. A scanning Auger microanalysis was performed on the surface and in depth on the gold deposit before and after heating. The observations reveal that the copper arrives at the gold surface especially via holes. The transport rate of the copper via theses holes is very fast compared to the diffusion via grain boundaries. The origin of the holes is discussed: they result of strains due to the gold epitaxial growth on copper grains.
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