Transparent polyamide-imide films with high Tg and low coefficient of thermal expansion: Design and synthesis

Abstract

Two series of optically transparent polyamide-imides (PAIs) were prepared by copolymerization of trimelletic acid chloride (TMAc), p-phthaloyl chloride (TPC), 2,2′-bis(trifluoromethyl)-[1,1′-biphenyl]-4,4′-diamine (TFDB) and 4,4’-(9-fluorenylidene) diamine (FDA). These series of PAIs displayed high glass transition temperatures (Tgs) ranging from 340 to 441 °C, 5% weight loss temperatures (T5%s) in nitrogen with 459–505 °C, and low coefficient of thermal expansion (CTE) of 21–56 ppm/K, which greatly affected by the feed ratio of rigid TPC units and cardo diamine in the polymer main chain. The transmittances at 500 nm (T500nm) of the PAI films were found in the range of 70.0–87.7%, All polymers demonstrated good organosolubility and mechanical properties with tensile strengths of 77–146 MPa, tensile moduli of 2.9–5.8 GPa and elongations at break of 2.9–8.2%. PAI-7-8 presented the best combination of high Tg of 401 °C and high tensile modulus of 5.0 GPa, low CTE value of 24 ppm/K, and high transparency (T500nm) of 87.2%.