Abstract
Utilization of methods involving component integration has accelerated, owing to the growth of the smart mobile industry. However, this integration leads to interference issues between the components, thereby elucidating the importance of the electromagnetic interference (EMI) shielding technology to solve such issues. EMI shielding technology has been previously implemented via the reflection or absorption of electromagnetic waves by using conductive materials. Nevertheless, to tackle the recent changes in the industry, a transparent and flexible EMI shielding technology is necessitated. In this study, a transparent and flexible EMI shielding material was fabricated by filling a conductive binder in a film comprising an intaglio pattern; this was achieved by using the ultraviolet (UV) imprinting technology to realize mass production. Subsequently, changes in the aperture ratio and shielding characteristics were analyzed according to the structure of the pattern. Based on this analysis, a square pattern was designed and a film with an intaglio pattern was developed through a UV imprinting process. Furthermore, it was confirmed that the transmittance, conductivity, and EMI shielding rate of the film were altered while changing the coating thickness of the conductive particles in the intaglio pattern. The final film prepared in this study exhibited characteristics that satisfied the required EMI shielding performance for electric and electronic applications, while achieving flexible structural stability and transparency.
Highlights
Smart mobile devices are on the verge of becoming the centers of modern industry and culture due to the fact that various functions and services are being implemented in a single system, while characteristics of various systems are integrated into one device
The intaglio pattern was designed in the opposite direction to that of the existing pattern, and it was possible to achieve an economical manufacturing process by applying the soft molding technique
It was confirmed that a difference in conductivity occurred depending on the structure of Surface Resistance Binder Thickness electromagnetic interference (EMI) Performance
Summary
Smart mobile devices are on the verge of becoming the centers of modern industry and culture due to the fact that various functions and services are being implemented in a single system, while characteristics of various systems are integrated into one device. With an increase in the use of smart devices and further development of their functions, the transparency and flexibility of packaging materials is considered important [14,15]. Various studies have been carried out to form a conductive pattern using silver and copper nanowires [18,19,20]; the conductivity and shielding properties tend to be limited To solve this problem, a hybrid system that utilizes two r more technologies has been proposed. We designed a process that can realize transparent/shielding/flexible characteristics at the same time and looked at the reproduction process of the technology thisrtoicusgahtotuhte tshaemeenttiimreeparnodcelosos.kTedheatstthepe roefpfroordmuicntigona ppraotcteesrns otfothime ptelcehmneonlot gsyoftthmrooulgdhinogut atnhdetehnetisreeaprcrhocfeosrs.thTehoepsttiempaolfpfaotrtmerinngstarupcattuterernthtoroiumgphlesmimeunltastoioftnm, eovladliunagtiaonndotfhreessienartcoh cofonrfitrhme otphteimUaVl pcuatrtienrgn ssytrsutecmtu,reevtharlouuagtihonsimofucloantidonu,cetivvaelupartoiopnerotifersesoifnctooncdouncfitrivme tphaerUti-V clceusr,ianngdsyfastbermic,aetivoanluuastiinogn pofatctoenrndeudctfiivlme ptrhorpoeurgtihessoofftcmonodlduicntigvewpeawrtoiculelds, laikned tfoaberxipcalatiionn thuesionvgepraaltlterernseeadrcfihlmonthtrhoeudgehsisgonftamndoldmiansgswpreowduouctlidonlikperotoceesxspolfaitnhethseysotveemra, lul pretsoeathrceh boansicthpeerdfeosrimgnanacnedevmaalussatpiornodoufcatnioEnMpIroshceieslsdoinf gthfeilmsy.stem, up to the basic performance evaluation of an EMI shielding film. The EMI shielding effect is expressed by filling a conductive material in the void area made through soft molding
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