Abstract
The miniaturization of components in modern electronics has made them more susceptible to electromagnetic interference (EMI); therefore, this study proposes a new low-cost method for fabricating highly efficient shielding materials. This approach uses a low cost combination of inverted layer processing of silver nanowires (AgNWs) to produce a conductive network in a polyimide surface, followed by electroless plating of Cu to further enhance conductivity. This results in a highly efficient (>55dB) EMI shielding film that is less than 10μm thick, transparent (>58% transmittance), and sufficiently flexible to maintain its conductivity after bending to a radius of 3mm for 10,000 times.
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