Abstract
Design of high-performance electronic components with stable static and dynamic characteristics requires a study of self-heating on electrical properties. TLM method is used to model electrothermal behavior of PIN diodes. Simulation results show a non-uniform temperature distribution in the device. TLM simulation results are in good agreement with those obtained by DESSIS-ISE commercial simulator. TLM computational effort is only a fraction of that required by finite element methods. TLM method is useful in dealing with nonlinear problems since it is unconditionally stable. Modeling and analysis results show that device self heating depends very much on material physical parameters and its geometry. In addition, it has been observed that blocking and conduction times influence heat dissipation.
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