Abstract
Growth kinetics of the Al 2Cu (θ) precipitate in an Al–1.5Cu alloy thin film were characterized in situ using transmission electron microscopy (TEM). The sizes of θ precipitates during isothermal growth in TEM were measured during aging at 250, 275 and 300 °C. The results of precipitate growth were analyzed based on the model of the “collector plate mechanism” for bulk alloys. The lengthening of the θ precipitate in thin film varies as t 0.29 for short annealing times (up to ∼10–20 min) at temperatures between 250 and 300 °C. This is in good agreement with the analysis in bulk alloys. For longer annealing time, however, the t 0.29 time law does not fit as the distances of Cu volume diffusion exceed one half of the film thickness.
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