Abstract
The crystallography and the interface structure of a unidirectionally solidified Cu-MgCu2 eutectic alloy have been examined by transmission electron microscopy. The microstructure of the eutectic was found to be lamellar and regularly interrupted by faults. The preference of the particular orientation relationship\(((\bar 1\bar 11)_{Cu} //(11\bar 1)_{MgCu_2 } )\) could not be explained by relative atomic densities of the planes comprising the interface. Based on the defect contrast observed and extinction distance calculations, it is suggested that the fine array of defects observed at the interface may be characterized as steps with step vectors parallel to\(\left[ {110} \right]_{_{MgCu_2 } } \) or\(\left[ {01\bar 1} \right]_{_{MgCu_2 } } \) Dislocations were also observed at the interface but they were rarely regular.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
