Transmission and scattering on interconnects with via structures

Abstract

Multivia interconnect structures for printed circuit boards (PCBs) have been analyzed by decomposing the geometry into exterior and interior structures. In this paper, we include the effects of dielectric substrates in the exterior structure. The exterior problem is solved by using the method of moments (MoM). The impedance-matrix elements are evaluated by using a fast method of calculating the layered-medium Green's function. The RWG basis functions are also utilized. Combined with the Foldy–Lax equation for solving the interior structure of a cylindrical vias problem, we analyze the transmission and scattering characteristics of interconnects with via structures. The numerical results of the scattering matrix are obtained for various via structures with a through-hole via and a single-layered via. The results obtained using commercial modeling tools such as HFSS and IE3D are also compared. The differential signaling of common and differential modes of coupled interconnects are illustrated. © 2005 Wiley Periodicals, Inc. Microwave Opt Technol Lett 46: 446–452, 2005; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.21013