Abstract
During a typical wave soldering operation a plated through hole (PTH) is exposed to temperatures which are higher than any rated operating temperatures. Understanding the heat transfer and the potential PTH damage mechanisms, which arise during the wave soldering process, is critical to PTH quality control and reliability. In particular, cracks may be initiated during the wave soldering transient and become manifest only after operational cycling. This paper presents a transient nonlinear thermal stress analysis of a nonsolder filled PTH that is subjected to a typical wave soldering process. A full three-dimensional orthotropic analysis and an axisymmetric analysis with cylindrically anisotropic properties are used and the results compared. Temperature and stress/strain history curves are examined to determine the impact of the wave soldering operation on the PTH fatigue life. The effect of PWB innerplanes on the PTH maximum stress and strain is also investigated.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
