Transient thermal finite-element analysis of fused filament fabrication process

Abstract

PurposeThe thermal behavior at the interfaces (of the deposited strands) during fused filament fabrication (FFF) technique strongly influences bond formation and it is a time- and temperature-dependent process. The processing parameters affect the thermal behavior at the interfaces and the purpose of the paper is to simulate using temperature-dependent (nonlinear) thermal properties rather than constant properties.Design/methodology/approachNonlinear temperature-dependent thermal properties are used to simulate the FFF process in a simulation software. The finite-element model is first established by comparing the simulation results with that of analytical and experimental results of acrylonitrile butadiene styrene and polylactic acid. Strand temperature and time duration to reach critical sintering temperature for the bond formation are estimated for one of the deposition sequences.FindingsTemperatures are estimated at an interface and are then compared with the experimental results, which shows a close match. The results of the average time duration (time to reach the critical sintering temperature) of strands with the defined deposition sequences show that the first interface has the highest average time duration. Varying processing parameters show that higher temperatures of the extruder and envelope along with higher extruder diameter and lower convective heat transfer coefficient will have more time available for bonding between the strands.Originality/valueA novel numerical model is developed using temperature-dependent (nonlinear) thermal properties to simulate FFF processes. The model estimates the temperature evolution at the strand interfaces. It helps to evaluate the time duration to reach critical sintering temperature (temperature above which the bond formation occurs) as it cools from extrusion temperature.