Transient Thermal Analysis of the Circuit Breaker Current Path with the Use of FEA Simulation

Michał Szulborski,Sebastian Łapczyński,Łukasz Kolimas,Daniel Zalewski

doi:10.3390/en14092359

Michał Szulborski, Sebastian Łapczyński + Show 2 more

Open Access

https://doi.org/10.3390/en14092359

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Abstract

The finite element analysis (FEA) is an essential and powerful numerical method that can explicitly optimize the design process of electrical devices. In this paper, the employment of the finite element method (FEM) as ANSYS is proposed in order to aid electrical apparatus engineering and modeling of low voltage modular circuit breakers. The procured detailed model of a miniature circuit breaker (MCB) was undergoing transient thermal simulations of the current path. Acquired data were juxtapositioned with experimental data procured in the laboratory. The reflection of the simulation approach was clearly noted in the experimental results. Mutual areas of the modeled element expressed similar physical properties and robustness errors while tested in the specific conditions—faithfully reflecting those that were experimented with. Moreover, the physical phenomena essential for electrical engineering could be determined on the model stage. These types of 3D models can be used to analyze the thermal behavior of the current path during the current flowing condition.

Highlights

Miniature circuit breakers (MCB) are constructed in accordance with current standards (e.g., European standards; IEC 60947)
Designing electrical apparatus is based on the use of tools for computer-aided design and prototyping of computer-aided design (CAD) and computeraided engineering (CAE) types
The overload release of low voltage modular circuit breakers is located in the main circuit of the electrical apparatus

Summary

Introduction

Miniature circuit breakers (MCB) are constructed in accordance with current standards (e.g., European standards; IEC 60947). During the process of extinguishing the electric arc in the circuit breaker, complex physical phenomena occur, such as heat released in the arc channel and the formation of electrodynamic forces, causing stress, affecting the contacts of the circuit breaker [4]. These phenomena affect the structural elements the device is made of (copper; steel; ferromagnetic; bimetals; aluminum; polymers, etc.). These occurrences can cause damage to the breaker after exceeding the critical values of electrical durability or temperature [5]

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