Transient temperature control performance evaluation of a novel hybrid PCM-based active heat sink

Abstract

In this study, a novel hybrid PCM-based active heat sink is proposed for temperature control management of transient high heat flux shock electronic devices. The temperature control features of the novel hybrid PCM-based active heat sink are numerically studied under the periodic heat flux condition. Impacts of parameters, including phase-change temperatures, heat transfer coefficient, heat sink parameters, and porosity of the porous metal structure embedded in PCM, are numerically investigated. Then the thermal control performance ratio is evaluated. Results reveal that the innovative hybrid PCM-based active heat sink achieves an outstanding temperature management performance when compared to a heat sink without PCM. And the temperature is reduced by more than 10 K. Increasing the height and width of the heat sink can make the temperature distribution more consistent, but an excessive increase seems unnecessary. Compared with pure PCM, When the porosity of porous metal structure decreases from 0.96 to 0.76, the initial melting time of PCM is delayed by 38.7%, and the solidification time is accelerated by 30.2%.