Transient solidification of a flowing liquid at a heat conducting wall

Abstract

The solidification of a flowing liquid at the heat conducting wall of a channel or a tube is investigated. The initial temperature of the wall is below the solidification temperature of the liquid, whereas the temperature of the liquid at the channel entrance is higher than the solidification temperature. While penetrating into the channel, the liquid is cooled due to heat transfer from the liquid to the solidified layer. On the other hand, the temperature of the channel rises due to heat transfer from the solidified layer to the channel wall. Both effects are taken into account in the analysis. If the wall temperature increases to values above the solidification temperature of the liquid, the solidified layer eventually disappears locally.