Abstract
Reliable bonding of thick Al wires and plated Au pad is important for the packaging of power modules. The interfacial phases of the Al/Au/Cu joint after parallel gap micro-resistance welding were observed by transmission electron microscopy (TEM). Obvious Al, Au and Cu elemental interdiffusion can be observed by energy dispersive spectrometer (EDS) mapping, indicating the occurring of sufficient interfacial reaction. Under the effect of current and heat, the core temperature is higher than the melting point of Al. Liquid Al will react with Au and (Au, Cu) Al2 intermetallic compound (IMC) phase was formed rapidly within 20 ms. Besides, excessive Al atoms rapidly diffuse through the Cu-based solid solution, and react with Cu forming (Cu, Au) Al4 IMC phase.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
