Transient fracture of a piezoelectric-piezomagnetic sandwich structure: anti-plane case

Abstract

In this article, we investigate the transient fracture behavior of piezoelectric (PE)–piezomagnetic (PM) sandwich structures under combined anti-plane shear mechanical and in-plane electrical impacts. A PM layer with an eccentric crack is sandwiched between two dissimilar PE layers. The Laplace and Fourier transforms are employed to reduce the mixed boundary valued problem to a standard Cauchy singular integral equation of the first kind in the Laplace transform domain. Then the Cauchy singular integral equation is solved by the Gauss–Chebyshev collocation method. By utilizing the numerical Laplace inversion, the dynamic stress intensity factors (DSIFs) are obtained in the time domain. Numerical results are presented to show the effects of the material combinations, crack location, structure geometries and electromechanical coupled loads on DSIFs. The findings of the present paper may be useful for the design and fracture prediction of layered PE–PM structures.