Abstract
Transient Electromagnetic–Thermal Co-Simulation of Microwave/RF Integrated Circuits by the HIE-FDTD Method
Full Text
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callSimilar Papers
Paper Title
Journal
Date
More From: IEEE Transactions on Microwave Theory and Techniques
Paper Title
Journal
Date
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
