Abstract
In many microsystems (MEMS), thermal effects have significant importance and system-level electro-thermal simulation is needed to shorten the product development cycle and to increase system reliability. The possibilities for space-continuous simulation of electro-thermal problems using an analogue simulator and an analogue hardware description language are described. In comparison to commercial finite element simulators, the relative error of thermal simulation is <0.08% for three-dimensional static analyses. Transient thermal problems with coupled electronic components are simulated.
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