Transient Crack Growth Behavior Under Cycle/Time-Dependent Step Loading for Pb-Containing and Pb-Free Solders

Abstract

In the present study, fatigue crack growth tests of Pb-containing [Sn-37Pb (wt.%)] and Pb-free [Sn-3.0Ag-0.5Cu (wt.%)] solders were performed under cycle/time-dependent step loading at a constant J-integral range (ΔJ). The C* parameter was also estimated for discussing time-dependent crack growth behavior. The experimental results indicated that acceleration of the crack growth rate at the beginning of the second loading step was induced when the C* value for the first loading step was high, regardless of time- or cycle-dependent crack growth and for both Sn-37Pb and Sn-3.0Ag-0.5Cu solders. The length of the acceleration region of the crack growth rate for both solders was in good agreement with the creep damage zone size estimated by the creep zone model proposed by Riedel and Rice.