Abstract
The transient heat transfer for laminar flow inside a circular microtube, embedded in a rectangular substrate, during power startup has been numerically investigated using the finite element method. Silicon and silicon carbide were the substrates used, and water and FC-72 were the working fluids. Equations governing the conservation of mass, momentum, and energy were solved in the fluid region. Within the solid wafer, the heat-conduction equation was solved. A thorough investigation for velocity and temperature distributions for different substrates and coolants was performed by varying geometrical dimensions. The Prandtl number, thermal conductivity ratio, and diameter ranges were 6.78-12.68, 27-2658, and 300-1000 pm, respectively
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
