Abstract
In an environment where the most power and performance is needed at the least cost, engineering is always looking at how to optimize existing hardware features. This is done through system engineering solutions and optimized software. This paper will describe the concept architecture, design and development cycle of how a High performance computing (HPC) and Artificial Intelligence (AI) Intel® Server System product family featuring Intel® Xeon® Platinum processors was manufactured. This was a grounds-up server chassis design with one chassis supporting multiple skus with air and liquid cooling, half and full width, & 1U/2U options all in one highly configurable system. The paper will cover the unique features including front I/O and shared cooling to start. The next section dives into the modeling techniques used that allowed to compress the manufacturing cycle to permit going from prototype to Hard Tool Chassis within 20 weeks. Using HT samples for the entire product qualification enabled the team to shift left and build confidence on product quality and reliability. We then deep dive and conclude with the Outsource Design Manufacturer (ODM) engagement and the technical challenges encountered in delivering this chassis backed by Intel’s design excellence and manufacturing expertise with processing power enabling high levels of flexibility, manageability, and reliability.
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