Abstract
This paper describes the transfer of thin gold films deposited on rigid silicon substrates to polydimethylsiloxane (PDMS) with reliable and strong bonding. Modification of the Au surfaces with (3-mercaptopropyl)trimethoxysilane (MPTMS) as a molecular adhesive was carried out to promote adhesion between Au and PDMS. The degree of bonding with respect to the concentration of MPTMS, treatment time and methods of deposition was investigated by a simple adhesion test using two different adhesive tapes. The effect of hydrolysis of MPTMS is discussed based on the bonding mechanism of MPTMS to the PDMS prepolymer. Also, the adsorption of MPTMS on Au deposited by different methods is discussed. The results indicate that liquid deposition of MPTMS provides the strongest adhesion between Au and PDMS among the different deposition methods and the different linker molecules. Based on these studies, the Au patterns with linewidth of less 2 µm were successfully transferred to PDMS with reliable and strong bonding in a full 3 inch wafer scale, using a dry peel-off process.
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