Trajectory planning of deep-cutting laser profiling of superabrasive profile grinding wheels

Abstract

The low profiling efficiency is the key barrier to the industrial application of laser dressing technology for profile grinding wheels. In this paper, the trajectory planning method of deep-cutting laser profiling was proposed for the first time, the theoretical model of the energy distribution of the Gaussian laser beam on the surface of the profile grinding wheel was established, and the effect of this method on improving the profiling efficiency of superabrasive profile grinding wheel was systematically studied. Through comparative experiments, it was confirmed that the trajectory planning method could effectively improve the profiling efficiency of the V-shaped grinding wheel, and it was found that the smaller the tip angle, the greater the efficiency improvement. The change of grain size will lead to the change of grain removal method, which will affect the profiling efficiency of V-shaped grinding wheel, but it has little influence on the profiling accuracy. The V-tip arc radius of the diamond grinding wheel with a particle size of 20–180 μm after laser profiling could be controlled between 10 and 20 μm, which was difficult to achieve by mechanical or electrical dressing method. The trajectory planning method could also significantly improve the profiling efficiency of convex/concave arc-shaped grinding wheels, and the greater the arc radius or chord-to-diameter ratio of the grinding wheel, the greater the efficiency improvement. Even though convex/concave arc-shaped grinding wheels were the same size, their profiling efficiency and material removal efficiency were quite different. For grinding wheels with different arc radii or chord-to-diameter ratios, different process strategies should be selected during laser profiling to ensure a comprehensive balance between efficiency, accuracy and quality.