Traces of non-compact glide in the dislocation structure of copper after creep at high temperatures

Abstract

Investigations of the steady-state creep in polycrystalline copper at temperatures from 773 to 1073 K oriented to induce a participation of dislocation glide in non-compact (NC) planes, lead to the conclusion that NC glide does not control the creep rate but rather appears in the dislocation glide process of creep as a local event. The analysis of a large set of data obtained by transmission electron microscopy reveals dislocation segments situated in NC planes, single screw dislocations and dislocation loops cross-slipping between two NC planes. These phenomena are most probably traces of NC glide.