Abstract
Growth hillocks ordinarily cover the surface of copper electrodeposits from reagent grade solutions. A 75% decrease in the number of hillocks was observed when the plating baths were purified by pre‐electrolysis and oxidation. When gelatin or Pb++ were added in parts per million or parts per billion concentration to the purified solutions, the surfaces of new electrodeposits were then completely covered with growth hillocks. It is concluded that the formation of surface features during electrodeposition from reagent grade solutions is affected by the presence of trace impurities.
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