Abstract
Abstract Total reflection X-Ray FKiorescence (TXRF) originally was developed for trace analysis of small residues but has become a widespread method for measuring trace surface metal contamination on semiconductor substrates. It is estimated that approximately 100 TXRF instruments are in use in the semiconductor industry worldwide, and approximately half that for residue analysis in analytical laboratories. TXRF instrumentation is available today for reaching detection limits of the order of 109 atoms/cm2. This review emphasizes some of the more recent developments in TXRF for trace analysis, in particular with the use of synchrotron x-ray sources (SR-TXRF). There is some promise of reaching 107 atoms/cm2 detection limits for surface analysis of semiconductor substrates.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
