Abstract
In this research a series of polyimides were prepared by different combinations of dianhydride monomers and diamine monomers. Such prepared polyimides were then subjected to systematic examinations on the associated physical properties such as coefficients of thermal expansion (CTEs), glass transition temperatures (Tgs), as well as the significant mechanical characteristics including tensile strengths and elongations. The observed physical and mechanical significances of the prepared polyimides were then analyzed to define the thermoplastic polyimides which are appropriate for the applications in the flexible printed circuit board (FPCB) industry. The structures and surface compositions of the prepared polyimides were characterized by Fourier transform infrared spectrometry (FTIR) and Thermal mechanical analyzer (TMA), and Universal Tensile Tester.
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